Program type:

Major
Format:

On Campus
Est. time to complete:

2 years
Credit Hours:

34
Transform the future of semiconductor manufacturing
The Master of Science in Semiconductor Manufacturing Engineering helps students qualify for jobs in a desirable, vital and growing field. This face-to-face program is interdisciplinary and students from science, engineering and computer science programs are eligible to apply.

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Why Earn a Master's in Semiconductor Manufacturing Engineering

Are you a recent graduate of a science, engineering or computer science bachelor’s program? Narrow your academic focus to an in-demand job market.

Looking to advance your career or pivot into a new discipline? Gain knowledge in a desirable, vital and growing field. 

As industry continues to expand opportunities in the semiconductor manufacturing field, building on your STEM background with a master’s in semiconductor manufacturing engineering transforms you into a highly desirable entity for the workforce. Chips are used in a multitude of fields such as communications, artificial intelligence, cybersecurity, healthcare, aerospace, automotive, advanced manufacturing, transportation, energy and more.  

Students will develop technical and soft skills, including semiconductor device fabrication, packaging, testing, characterization, materials properties, problem solving, data analysis and oral and written communication skills. Our program enables students to acquire knowledge in semiconductors that they can apply immediately to the workforce upon graduation, becoming valuable assets for semiconductor companies, including Intel, AMD, Texas Instruments, TSMC, Micron Technology, Qualcomm, Samsung Electronics, Global Foundries, NVIDIA and STMicroelectronics.
Marketable Skills
  • Oral and written communication skills 
  • Engineering problem solving 
  • Data analysis in manufacturing 
  • Testing of semiconductor devices 
  • Troubleshooting semiconductor manufacturing processes

Semiconductor Manufacturing Engineering Master's Highlights

Gain hands-on experience through highly specialized equipment and state-of-the-art facilities at the Center for Microelectronics in Extreme Environments at UNT.
Our program provides excellent educational opportunities for students from various engineering disciplines, physics, chemistry and computer science to pursue the field of semiconductors.
With a shortage of master's degrees in semiconductor manufacturing, place yourself at the top of the list through this unique program.
Scholarships are available to qualifying students with the opportunity for tuition support and monthly stipends.
Our location allows students to pursue internships in the DFW area, which is home to 24 of the Fortune 500 headquarters and is the fourth largest metropolitan area in the US.
Through the completion of 6 hours of problem courses with a UNT faculty member, students expand their knowledge of semiconductor manufacturing by exploring a research topic that interests them.

Career Outlook

The CHIPS Act, signed in 2022, allocated $280 billion to combat the chip shortage. $53 billion of these funds will go toward revitalizing semiconductor manufacturing in the US. The SIA estimates that jobs in the semiconductor field will grow by 115,000 by 2030, a 33% growth from 2023. According to Lightcast, regional employment in the semiconductor industry is higher in Texas than the national average and is expected to remain high; jobs in semiconducting are projected to grow by 32.6% between 2018 and 2028.  

Much of the growth in semiconductors in Texas is located close to the UNT Denton campus. In Sherman, located only 56 miles from Denton, new chip and wafer plants will add more than 5,000 new jobs in semiconductors. Our proximity to the DFW area and Sherman will give our students nearby opportunities for internships and full-time employment upon graduation in our region and beyond.

Semiconductor Manufacturing Engineering Master's Courses You Could Take

MTSE 5530 – Integrated Circuit Packaging, 3 hours
Basic packaging concepts, materials, fabrication, testing and reliability, as well as the basics of electrical, thermal and mechanical considerations as required for the design and manufacturing of microelectronics packaging. Current requirements and future trends are presented. General review of analytical techniques used in the evaluation and failure analysis of microelectronic packages.
MEEN 5020 – Design of Experiments, 3 hours
Study of industrial analytical techniques used to develop new products and new technologies, including the use of engineering software for design purposes.
MTSE 5560 - Compound Semiconductor Materials and Devices
Introduction to compound semiconductors; epitaxial growth and electronic properties of heterojunctions (ideal single heterojunctions: isotype and anisotype; non-ideal heterojunctions; and heterojunctions); applications of heterostructures (heterojunction bipolar transistors, modulation-doped field-effects transistors, LEDS, double heterojunction lasers, photodiodes and photoconductors).
EENG 5520 – Design and Testing of Digital Systems
Review of combinational logic, testing combinational circuits, sequential circuit synthesis, state minimization, state assignment, and structure of sequential circuits; state identification and fault detection experiments; testing of sequential circuits and design for testability.
CSCE 5210 – Fundamentals of Artificial Intelligence
A broad understanding of the basic techniques for building intelligent computer systems and how AI is applied to solve problems. The emergent nature of intelligent behavior through robust and efficient sensation, knowledge representation, and decision making are demonstrated through a series of hands-on demonstrations and tutorials. Ethical implications of automation and autonomy of machines are discussed through case studies. This exposure provides the breadth to understand the capabilities to begin a deeper exploration of artificial intelligence.

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